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Consultant - EXPERT1420

Expert in R&D on electronics technologies, electronics packaging, electronics assembly & manufacturing, electronics reliability, microsystems, electronics miniaturisation, heterogeneous integration fo Expert in R&D on electronics technologies, electronics packaging, electronics assembly & manufacturing, electronics reliability, microsystems, electronics miniaturisation, heterogeneous integration for More than Moore, IoT, electronics for digitalisation and automatisation, Printed Circuit Boards, Embedding in substrates, Project Coordination and Leadership, Project Management, Program Management, Risk analysis, Technology Exploitation and Commercialisation strategies. electronics assembly & manufacturing technologies, electronics packaging technologies, wafer bumping, flip chip assembly, microsystems, senosr packaging, PCB technologies, Embedding PCB technologies, Heterogeneous Integration for More than Moore, electronics reliability, modularisation for automotive applications.

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Phone Call :- $ 250.00 / For 30-60 minute discussion

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Video/Skype call :- $ 250.00 / For 30-60 minute discussion

Face to Face meeting :- $ 250.00 / For 30-60 minute discussion